onsemi, MICROFJ-40035-TSV-TR1 Si Photodiode, Surface Mount TSV
- RS stock no.:
- 185-9625
- Mfr. Part No.:
- MICROFJ-40035-TSV-TR1
- Manufacturer:
- onsemi
7 Available from UK/Europe in 4–6 working days for collection or delivery to major cities (Heavy, hazardous or lithium product excluded. Delivery T&C's apply)
Not Available for premium delivery
Added
Price (Excl VAT) Each
R 1 055,63
(exc. VAT)
R 1 213,97
(inc. VAT)
| Units | Per unit |
| 1 - 4 | R 1 055,63 |
| 5 - 9 | R 1 029,24 |
| 10 - 24 | R 998,36 |
| 25 - 49 | R 958,43 |
| 50 + | R 920,09 |
- RS stock no.:
- 185-9625
- Mfr. Part No.:
- MICROFJ-40035-TSV-TR1
- Manufacturer:
- onsemi
Technical data sheets
Legislation and Compliance
- COO (Country of Origin):
- IE
Product Details
High-density microcells
J-Series sensors feature ON Semiconductor's unique 'fast output' terminal
Temperature stability of 21.5 mV/°C
Exceptional breakdown voltage uniformity of ±250 mV
Available in a reflow solder compatible TSV chip-scale package
Ultra-low dark count rates of 50 kHz/mm2 typical
Optimized for high-performance timing applications, such as ToF-PET
3 mm, 4 mm and 6 mm sensor sizes
Bias voltage of <30 V
Results in a 50% photon detection efficiency (PDE) at 420 nm
Improved signal rise time and the microcell recovery time
Negates the need for active voltage control
Industry-leading uniformity
TSV package results in almost zero deadspace allowing the creation of high fill factor arrays and is ferrous-metal free
Applications
Medical Imaging
Hazard & Threat
3D Ranging & Sensing
Biophotonics & Sciences
High Energy Physics
J-Series sensors feature ON Semiconductor's unique 'fast output' terminal
Temperature stability of 21.5 mV/°C
Exceptional breakdown voltage uniformity of ±250 mV
Available in a reflow solder compatible TSV chip-scale package
Ultra-low dark count rates of 50 kHz/mm2 typical
Optimized for high-performance timing applications, such as ToF-PET
3 mm, 4 mm and 6 mm sensor sizes
Bias voltage of <30 V
Results in a 50% photon detection efficiency (PDE) at 420 nm
Improved signal rise time and the microcell recovery time
Negates the need for active voltage control
Industry-leading uniformity
TSV package results in almost zero deadspace allowing the creation of high fill factor arrays and is ferrous-metal free
Applications
Medical Imaging
Hazard & Threat
3D Ranging & Sensing
Biophotonics & Sciences
High Energy Physics
Specification
Attribute | Value |
|---|---|
| Package Type | TSV |
| Amplifier Function | No |
| Mounting Type | Surface Mount |
| Number of Pins | 4 |
| Diode Material | Si |
| Minimum Wavelength Detected | 200nm |
| Maximum Wavelength Detected | 900nm |
| Length | 4mm |
| Width | 4mm |
| Height | 0.46mm |
| Series | J |
| Breakdown Voltage | 24.7V |
- RS stock no.:
- 185-9625
- Mfr. Part No.:
- MICROFJ-40035-TSV-TR1
- Manufacturer:
- onsemi