Heatsink, High Powered semiconductor Devices, Optoelectronic Devices, 8.2K/W, 40 x 40 x 18mm, Adhesive Foil
- RS stock no.:
- 750-0951
- Manufacturer:
- RS PRO
699 Available from UK/Europe in 4–6 working days for collection or delivery to major cities (Heavy, hazardous or lithium product excluded. Delivery T&C's apply)
Added
Price (Excl VAT) Each
R 61,54
(exc. VAT)
R 70,77
(inc. VAT)
| Units | Per unit |
| 1 - 24 | R 61,54 |
| 25 - 99 | R 60,00 |
| 100 - 249 | R 58,20 |
| 250 - 499 | R 55,87 |
| 500 + | R 53,64 |
- RS stock no.:
- 750-0951
- Manufacturer:
- RS PRO
Technical data sheets
Legislation and Compliance
- COO (Country of Origin):
- GB
Product Details
BGA Heatsink, Standard
Standard type BGA heatsink suitable for a variety of applications.
RS PRO Standard, Push Pin, Aluminium, BGA (Ball Grid Array) Heatsink, 8.2° C/W
From RS PRO this is a standard BGA (Ball Grid Array) Push Pin heatsink designed for excellent performance and precision easily integrating into your electronics, providing protection from circuits over heating maintaining operating temperatures, ensuring the reliable performance of your electronic devices. The aluminium heatsink is aluminium complete with anodized finish and is securely mounted by adhesive foil.
The RS PRO Heatsink is a vital component to maintain optimal temperature for your electronic components preventing overheating. When electronic components are working, they generate heat and if left the heat will build-up and can damage or reduce a components performance. The heatsink will absorb and dissipate the generated heat.
The RS PRO Heatsink is a vital component to maintain optimal temperature for your electronic components preventing overheating. When electronic components are working, they generate heat and if left the heat will build-up and can damage or reduce a components performance. The heatsink will absorb and dissipate the generated heat.
Features and Benefits
- BGA (Ball Grid Array) Heatsink
- Standard, Pushpin
- Made from aluminium
- Adhesive foil mounting
- Anodized finish
- For use with Universal rectangular Alu
- Thermal resistance 8.2° C/W
- Dimensions 40 mm L x 40 mm W x 18 mm H
Applications
- Surface mount chip cooling
- High powered semiconductors
- Optoelectronic devices and many more
Thermal Resistance
The thermal resistance for the BGA heatsink is calculated based on a distributed heat load and vertically mounted fins anodized heatsink with a 60°C temperature.
Why RS PRO?
RS PRO is the own brand of RS. The RS PRO Seal of Approval is your assurance of professional quality, a guarantee that every part is rigorously tested, inspected, and audited against demanding standards. Making RS PRO the Smart Choice for our customers.
BGA Heatsinks
Specification
Attribute | Value |
|---|---|
| For Use With | High Powered semiconductor Devices, Optoelectronic Devices |
| Length | 40mm |
| Width | 40mm |
| Height | 18mm |
| Dimensions | 40 x 40 x 18mm |
| Thermal Resistance | 8.2K/W |
| Mounting | Adhesive Foil |
| Colour | Black |
| Material | Aluminium |
| Package Type | BGA |
| Finish | Anodized |