TE Connectivity 2.54mm Pitch Vertical 32 Way, Through Hole Stamped Pin Closed Frame IC Dip Socket

Technical data sheets
Legislation and Compliance
COO (Country of Origin): US
Product Details

TE Connectivity DIPLOMATE Dual Leaf PCB Mount DIP Socket

DIPLOMATE Dual Leaf (DL) DIP sockets with stamped and formed dual wiping contacts for vertical, through hole PCB mounting. These DIPLOMATE Dual Leaf (DL) DIP sockets have black thermoplastic GF stackable housings with a 2.54mm centreline, and a "true closed bottom" design which prevents solder or flux wicking and standoffs to allow board clearance for cleaning after soldering. The profiles for these DIPLOMATE Dual Leaf (DL) DIP sockets are all standard apart from part number 719-8817 which has an over-the-component profile. These DIPLOMATE DIP sockets are available with different frame styles with either straight or retention legs.

Attribute Value
Number of Contacts 32
Mounting Type Through Hole
Pin Type Stamped
Pitch 2.54mm
Row Width 15.24mm
Frame Type Closed Frame
Termination Method Solder
Contact Plating Tin
Orientation Vertical
Length 40.51mm
Width 5.33mm
Depth 17.63mm
Dimensions 40.51 x 5.33 x 17.63mm
Contact Material Beryllium Copper
Maximum Operating Temperature +105°C
Minimum Operating Temperature -55°C
Housing Material Thermoplastic
39 Available from UK/Europe in 4–6 working days (Covid-19 flight delays could impact quoted delivery times) for collection or delivery to major cities (Heavy, hazardous or lithium product excluded. Delivery T&C's apply)
Price (Excl VAT) Each (In a Box of 13)
R 10.415
(exc. VAT)
R 11.977
(inc. VAT)
Per unit
Per Box*
13 +
R 10.415
R 135.395
*price indicative
Not Available for premium delivery