50Ω STMicroelectronics Surface Mount Chip Balun

Technical data sheets
Legislation and Compliance
Compliant
Product Details

Baluns use ST’s process integrating high-quality RF passive components on a single glass substrate. As well as balanced/unbalanced conversion, they can also integrate a matching network in a footprint smaller than 1 mm² for the complete function. ST's latest balun-the 1.2 mm² footprint BALF-NRG-02D3-is customized for our BlueNRG-1 and new BlueNRG-2 transceivers, reducing RF complexity and providing optimized link budget

The BALF-ATM-01E3 from STMicroelectronics is an integrated balun, which also integrates a matching network in a monolithic glass substrate. Matching impedance has been customized for the ATMEL chip. The device uses STMicroelectronics’ IPD technology on a non-conductive glass substrate to optimize RF performance

2.4 – 2.5 GHz balun with integrated matching network
Matching optimized for following chipsets: ATSAMR21E18
Low insertion loss
Low amplitude imbalance
Low phase imbalance
Coated CSP on glass bumpless
Small footprint 2.5 mm²

Specification
Attribute Value
Unbalance Impedance 50Ω
Balance Impedance 50Ω
Maximum Insertion Loss 1.3dB
Mounting Type Surface Mount
Pin Count 6
Dimensions 2.1 x 1.35 x 0.455mm
Height 0.455mm
Length 2.1mm
Width 1.35mm
Maximum Frequency 2.5GHz
Minimum Frequency 2400MHz
Maximum Operating Temperature +105°C
Minimum Operating Temperature -40°C
4950 Available from UK/Europe in 4–6 working days (Covid-19 flight delays could impact quoted delivery times) for collection or delivery to major cities (Heavy, hazardous or lithium product excluded. Delivery T&C's apply)
Price (Excl VAT) Each (In a Pack of 50)
R 6.542
(exc. VAT)
R 7.523
(inc. VAT)
units
Per unit
Per Pack*
50 - 50
R 6.542
R 327.10
100 - 950
R 6.412
R 320.60
1000 +
R 6.219
R 310.95
*price indicative
Not Available for premium delivery
Packaging Options: