Arcol Ohmite

Electronics Heating & Cooling Components

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Electronics Heating & Cooling Components
(74) Heatsinks
(14) Thermal Pads
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Product Details
Heatsink, TO-252, TO-263 and TO-268, 12.7 x 30.99 x 11.68mm
  • R 47.027
    Each (On a Reel of 200)
Heatsink, TO-252, TO-263 and TO-268, 12.7 x 30.99 x 11.68mm
  • For Use WithTO-252, TO-263 and TO-268
  • Length12.7mm
  • Width30.99mm
  • Height11.68mm
  • Dimensions12.7 x 30.99 x 11.68mm
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Heatsink, TO-252, TO-263 and TO-268, 12.7 x 30.99 x 11.68mm
  • R 56.31Each
  • Also available in industry standard packaging
Heatsink, TO-252, TO-263 and TO-268, 12.7 x 30.99 x 11.68mm
  • For Use WithTO-252, TO-263 and TO-268
  • Length12.7mm
  • Width30.99mm
  • Height11.68mm
  • Dimensions12.7 x 30.99 x 11.68mm
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Heatsink, IXYS I4 and CPC PAK, Ohmite CS10, TO-220, TO-247, 55 x 33.9 x 39.5mm
  • R 94.445
    Each (In a Box of 40)
Heatsink, IXYS I4 and CPC PAK, Ohmite CS10, TO-220, TO-247, 55 x 33.9 x 39.5mm
  • For Use WithIXYS I4 and CPC PAK, Ohmite CS10, TO-220, TO-247
  • Length55mm
  • Width33.9mm
  • Height39.5mm
  • Dimensions55 x 33.9 x 39.5mm
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Heatsink, TO-247 and TO-264 Devices, 55 x 31 x 38mm, Vertical
  • R 108.86
    Each (In a Box of 160)
Heatsink, TO-247 and TO-264 Devices, 55 x 31 x 38mm, Vertical
  • For Use WithTO-247 and TO-264 Devices
  • Length55.12mm
  • Width31.5mm
  • Height38.61mm
  • Dimensions55 x 31 x 38mm
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Heatsink, TO-218, TO-220, TO-247, 25.4 x 41.6 x 25mm, Vertical
  • R 42.15Each
Heatsink, TO-218, TO-220, TO-247, 25.4 x 41.6 x 25mm, Vertical
  • For Use WithTO-218, TO-220, TO-247
  • Length25.4mm
  • Width41.6mm
  • Height25mm
  • Dimensions25.4 x 41.6 x 25mm
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Heatsink, TO-220 and TO-247 Devices and Bridge Rectifiers, 16.28 x 16.3 x 25.4mm, PCB Through Hole
  • R 31.91Each
Heatsink, TO-220 and TO-247 Devices and Bridge Rectifiers, 16.28 x 16.3 x 25.4mm, PCB Through Hole
  • For Use WithTO-220 and TO-247 Devices and Bridge Rectifiers
  • Length16.28mm
  • Width16.3mm
  • Height25.4mm
  • Dimensions16.28 x 16.3 x 25.4mm
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Heatsink, IXYS I4 and CPC PAK, Ohmite CS10, TO-220, TO-247, 55 x 33.9 x 39.5mm
  • R 100.97Each
Heatsink, IXYS I4 and CPC PAK, Ohmite CS10, TO-220, TO-247, 55 x 33.9 x 39.5mm
  • For Use WithIXYS I4 and CPC PAK, Ohmite CS10, TO-220, TO-247
  • Length55mm
  • Width33.9mm
  • Height39.5mm
  • Dimensions55 x 33.9 x 39.5mm
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Thermal Interface Pad, Silicone, 3W/m·K, 49.1x28mm 0.5mm
  • R 34.43Each
Thermal Interface Pad, Silicone, 3W/m·K, 49.1x28mm 0.5mm
  • Dimensions49.1x28mm
  • Thickness0.5mm
  • Length49.1mm
  • Width28mm
  • Diameter3.2mm
See similar products in Thermal Pads
Heatsink, TO-220 and TO-247 Devices and Bridge Rectifiers, 16.28 x 16.3 x 38.1mm, PCB Through Hole
  • R 31.857
    Each (In a Box of 25)
Heatsink, TO-220 and TO-247 Devices and Bridge Rectifiers, 16.28 x 16.3 x 38.1mm, PCB Through Hole
  • For Use WithTO-220 and TO-247 Devices and Bridge Rectifiers
  • Length16.28mm
  • Width16.3mm
  • Height38.1mm
  • Dimensions16.28 x 16.3 x 38.1mm
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Heatsink, 1.3°C/W, 127 x 100 x 31mm, Screw
  • R 851.68Each
Heatsink, 1.3°C/W, 127 x 100 x 31mm, Screw
  • Length127mm
  • Width100mm
  • Height31mm
  • Dimensions127 x 100 x 31mm
  • Thermal Resistance1.3°C/W
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Thermal Interface Pad, Silicone, 3W/m·K, 48.7x47.5mm 0.5mm
  • R 42.07Each
Thermal Interface Pad, Silicone, 3W/m·K, 48.7x47.5mm 0.5mm
  • Dimensions48.7x47.5mm
  • Thickness0.5mm
  • Length48.7mm
  • Width47.5mm
  • Diameter4.4mm
See similar products in Thermal Pads
Thermal Interface Pad, Silicone, 3W/m·K, 127.7x72.5mm 0.5mm
  • R 129.82Each
Thermal Interface Pad, Silicone, 3W/m·K, 127.7x72.5mm 0.5mm
  • Dimensions127.7x72.5mm
  • Thickness0.5mm
  • Length127.7mm
  • Width72.5mm
  • Diameter6.6mm
See similar products in Thermal Pads
Thermal Interface Pad, Silicone, 3W/m·K, 109.7x72.5mm 0.5mm
  • R 131.01Each
Thermal Interface Pad, Silicone, 3W/m·K, 109.7x72.5mm 0.5mm
  • Dimensions109.7x72.5mm
  • Thickness0.5mm
  • Length109.7mm
  • Width72.5mm
  • Diameter5.1mm
See similar products in Thermal Pads
Heatsink, TO-252, TO-263 and TO-268, 12 x 25 x 12mm
  • R 37.09Each
  • Also available in industry standard packaging
Heatsink, TO-252, TO-263 and TO-268, 12 x 25 x 12mm
  • For Use WithTO-252, TO-263 and TO-268
  • Length12.07mm
  • Width25.9mm
  • Height12.19mm
  • Dimensions12 x 25 x 12mm
See similar products in Heatsinks
Thermal Interface Pad, Silicone, 3W/m·K, 65.2x47.5mm 0.5mm
  • R 40.315
    Each (In a Box of 25)
Thermal Interface Pad, Silicone, 3W/m·K, 65.2x47.5mm 0.5mm
  • Dimensions65.2x47.5mm
  • Thickness0.5mm
  • Length65.2mm
  • Width47.5mm
  • Diameter4.4mm
See similar products in Thermal Pads
Heatsink, TO-252, TO-263 and TO-268, 12.7 x 25.91 x 10.16mm
  • R 35.219
    Each (On a Reel of 250)
Heatsink, TO-252, TO-263 and TO-268, 12.7 x 25.91 x 10.16mm
  • For Use WithTO-252, TO-263 and TO-268
  • Length12.7mm
  • Width25.91mm
  • Height10.16mm
  • Dimensions12.7 x 25.91 x 10.16mm
See similar products in Heatsinks
Heatsink, TO-247 and TO-264 Devices, 55 x 31 x 38mm, Vertical
  • R 130.91Each
Heatsink, TO-247 and TO-264 Devices, 55 x 31 x 38mm, Vertical
  • For Use WithTO-247 and TO-264 Devices
  • Length55.12mm
  • Width31.5mm
  • Height38.61mm
  • Dimensions55 x 31 x 38mm
See similar products in Heatsinks
Heatsink, TO-252, TO-263 and TO-268, 12 x 26 x 11.68mm
  • R 47.00
    Each (On a Reel of 200)
Heatsink, TO-252, TO-263 and TO-268, 12 x 26 x 11.68mm
  • For Use WithTO-252, TO-263 and TO-268
  • Length12.07mm
  • Width26.16mm
  • Height11.68mm
  • Dimensions12 x 26 x 11.68mm
See similar products in Heatsinks
Heatsink, TO-247 and TO-264 Devices, 55 x 31 x 38mm, Vertical
  • R 136.31Each
Heatsink, TO-247 and TO-264 Devices, 55 x 31 x 38mm, Vertical
  • For Use WithTO-247 and TO-264 Devices
  • Length55.12mm
  • Width31.5mm
  • Height38.61mm
  • Dimensions55 x 31 x 38mm
See similar products in Heatsinks
Heatsink, BGA, CPU and GPU, 15 x 15 x 7.5mm, PCB Mount
  • R 95.55Each
Heatsink, BGA, CPU and GPU, 15 x 15 x 7.5mm, PCB Mount
  • For Use WithBGA, CPU and GPU
  • Length15mm
  • Width15mm
  • Height7.5mm
  • Dimensions15 x 15 x 7.5mm
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